Hotline: +86 13590460002
English
中文
中文
Home
About us
PCB assembly
Application
Capabilities
Support
Contact us
SUPPORT
Common problem
Trade Encyclopedia
Industry information
Trade Encyclopedia
08
2021.01
An Analysis of SMT Solder Paste Printing Defects
In SMT PCB production, solder paste printing is a critical step. Since the solder paste is used to directly form the soldering joint, the quality of solder paste printing affects the performance and reliability of the surface mount assembly. Quality solder paste printing guarantees a quality solder joint and final product. Statistics demonstrate that 60% to 90% of soldering defects are related to solder paste printing defects. So it is very important to understand what causes defects in solder paste printing.
In SMT PCB production, solder paste printing is a critical step. Since the solder paste is used to directly form the soldering joint, the quality of solder paste printing affects the performance and reliability of the surface mount assembly. Quality solder paste printing guarantees a quality solder joint and final product. Statistics demonstrate that 60% to 90% of soldering defects are related to solder paste printing defects. So it is very important to understand what causes defects in solder paste printing.
08
2021.01
How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process.
A solder ball is the most common type of defect that occurs in the SMT assembly process. Solder balls located within 0.13mm of traces violate the minimum electrical clearance principle. They can adversely affect the electrical reliability of the assembled PCB.
A solder ball is the most common type of defect that occurs in the SMT assembly process. Solder balls located within 0.13mm of traces violate the minimum electrical clearance principle. They can adversely affect the electrical reliability of the assembled PCB.
