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Process capability
Process Unit type Quantity Process
capability
Specifications data
Printing GKG GSE/G9 4 Steel mesh size Minimum size of screen frame
Maximum size of screen frame
370*470MM
737*737MM
PCB size PCB minimum size
Maximum size of PCB
50L*50W(MM)
400L*340W(MM)
PCB thickness PCB thickness 0.4-6MM
PCB deformation PCB board distortion MAX, PCB diagonal 1%
Precision Repeat positioning accuracy
Printing precision
±0.01MM
±0.025MM
MESH size 25-36um (Powder No. 4)
SMT machine YAMAHA YSM20
YAMAHA YSM10
YSM20*2
YSM10*4
PCB Size
requirements
Maximum size of PCB
PCB minimum size
810L*490W*6.5H(MM)-Dual Lane
510L*460W*15H(MM)-Single Lane
Conveyor 50L*40W*0.38H(MM)
SMT precision Chip/QFP/BGA ±0.035mm (±0.025mm) Cpk≧1.0 (3σ)
Applicable
component
specifications
original standard 0201 ~ W55 × L100mm, height below 15mm
AD hoc (FM) mounting head 03015 ~ 55×55mmL100mm, height below 28mm
Quantity of feeders YSM20
YSM10
140 pieces (converted with 8mm material belt)
48 pieces (converted by 8mm material belt)
Pallet exchanger Stationary
Skip type
30
10
PCB bending
requirements
Up
Down
0.5MM
1.5MM
Speed YSM20
YSM10
90,000CPH
46000CPH
Load shifting
machine/cache
machine
Combined xin 16 PCB thickness 0.4-6MM
PCB size 400L*250W(MM)
Reflow
soldering
JTR1000D dual
track JTR1000D
2 PCB size Monorail
Dual-track
>490mm
Dual-track < 270 mm
Temperature zone
number
Up and down Temperature range of 10
Can pass through
the height of the
original
Up 30
Down 25
SPI Capability
Zhenhua xing
VCTA-V850
3 PCB thickness 50mm×50mm~330mm×250mm
Solder paste
test size
0.15mm×0.15mm~10mm×10mm
Test items Volume, area, height, shape, deviation, tin, overflow,
tin, tin, less tin, tin, drawing, collapse, abnormity,
goldfinger, insufficient glue, etc
FOV view Standard 32mm×32mm
Solder paste
height range
10~400um
GRR <10%
AOI Torch line A0I
Zhenhuaxing
offline
VCTA-A410
4 PCB size 25MM×25MM~340MM×480MM
PCB thickness 0.5MM~2.5MM
PCB Warp degrees <2MM (assisted deformation correction by fixture)
Parts are highly Top≤25MM,Bottom≤70MM
Smallest parts 0201 components
Precision positioning <20 microns
Movement speed 700 mm/s (MAX)
Wave
soldering
Nitto UXT - 350 1 Width of the PCB 50mm~350 (MM)
Preheat the way On the heating Micro hot air
Lower heat zone Infrared
Furnace high
temperature
300℃